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Part Number |
Manufacturer |
Description |
Series | Type | Number of Positions or Pins (Grid) | Pitch | Mounting Type | Features | Contact Finish | Contact Finish Thickness |
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AR64-HZW/T-R |
Assmann WSW Components |
IC SOCKET MACH PIN WW 64POS AU |
- | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | - |
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518-77-478M26-131106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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558-10-520M31-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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110-93-640-41-801000 |
Mill-Max Manufacturing Corp. |
IC SOCKET W/CAP TIN MS ST 40 PIN |
110...801 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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518-77-480M29-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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4-1437531-1 |
TE Connectivity |
CONN SOCKET DIP 16POS WIRE WRAP |
500 | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | - | Wire Wrap | Closed Frame | Gold | - |
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550-10-500M30-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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550-10-504M29-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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714-43-264-31-018000 |
Mill-Max Manufacturing Corp. |
CARRIER W/ SOCKETS DBL 64POS |
714 | DIP, 0.1" (2.54mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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558-10-478M26-131101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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40-6554-10 |
Aries Electronics |
40 PIN ZIF SOCKET, TIN |
X55X | DIP, ZIF (ZIP) | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | 200µin (5.08µm) |
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550-10-560M33-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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242-1281-00-0602J |
3M |
SOCKET ZIP DIP 42POS GOLD .6 |
Textool™ | DIP, ZIF (ZIP) | 42 (2 x 21) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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558-10-480M29-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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514-83-652M35-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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228-1290-00-0602J |
3M |
SOCKET SHRINK DIP 28POS .070 |
Textool™ | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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558-10-500M30-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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518-77-500M30-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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232-1291-00-0602J |
3M |
SOCKET SHRINK DIP 32POS .070 |
Textool™ | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.070" (1.78mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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558-10-456M26-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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558-10-504M29-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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518-77-456M26-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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240-3639-00-0602J |
3M |
SOCKET ZIP DIP 40POS GOLD 1.0 |
Textool™ | DIP, ZIF (ZIP) | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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518-77-504M29-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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514-83-600M35-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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224-7397-55-1902 |
3M |
SOCKET SOIC 24POS LIDDED |
Textool™ | SOIC | 24 (2 x 12) | 0.050" (1.27mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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550-10-520M31-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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256-1292-00-0602J |
3M |
SOCKET SHRINK DIP 56POS .070 |
Textool™ | DIP, 0.6" (15.24mm) Row Spacing | 56 (2 x 28) | 0.070" (1.78mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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518-77-500M30-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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550-10-576M30-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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441-PRS21001-12 |
Aries Electronics |
ZIF PGA SOCKET 441 PIN 21 X 21 |
PRS | PGA, ZIF (ZIP) | 441 (21 x 21) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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518-77-456M26-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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44-547-11 |
Aries Electronics |
SOCKET UNIV SOIC ZIF TEST |
547 | SOIC, ZIF | 44 (4 x 11) | 0.050" (1.27mm) | Through Hole | Closed Frame | Gold | 20µin (0.51µm) |
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518-77-504M29-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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558-10-520M31-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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245-08-1-03 |
CNC Tech |
IC SOCKET 8 POS |
- | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole, Kinked Pin | Open Frame | Tin | 60µin (1.52µm) |
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518-77-520M31-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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4832-6004-CP |
3M |
SOCKET IC OPEN FRAME 32POS .6 |
4800 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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558-10-560M33-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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518-77-520M31-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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09-48-3031 |
Molex Connector Corporation |
TRANSISTOR SOCKET TO-220 .100 |
- | Transistor, TO-220 | 3 (Rectangular) | - | Through Hole | Closed Frame | Tin | - |
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550-10-600M35-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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2-641267-1 |
TE Connectivity |
CONN SOCKET VERT 28 POS TIN DIP |
Diplomate DL, AMP | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole, Press-Fit | Closed Frame | Tin | - |
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558-10-576M30-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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558-10-560M33-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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1825094-3 |
TE Connectivity |
CONN IC SOCKET 14POS DIP 15-GLD |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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518-77-560M33-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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1825373-4 |
TE Connectivity |
CONN IC SOCKET 16POS DIP 15-GLD |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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558-10-600M35-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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518-77-560M33-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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8452-21B1-RK-TP |
3M |
IC SOCKET 52POS PLCC SMD |
8400 | Chip Carrier, PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 160µin (4.06µm) |
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558-10-576M30-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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110-99-424-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN MS TIN/TIN .400 |
110...001 | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin-Lead | 200µin (5.08µm) |
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518-77-576M30-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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550-10-652M35-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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110-41-318-41-001000 |
Mill-Max Manufacturing Corp. |
CONN DIP OPEN FRAME .015-.025 |
110...001 | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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518-77-576M30-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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4606 |
Keystone Electronics |
SOCKET ALL PHENOLIC TO-3 CASE |
- | Transistor, TO-3 | 3 (Rectangular) | - | Chassis Mount | Closed Frame | Tin | - |
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558-10-600M35-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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518-77-600M35-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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110-43-210-10-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET DIP RELAY 6 PIN GOLD |
110...001 | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5), 6 Loaded | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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518-77-600M35-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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4600 |
Keystone Electronics |
SOCKET TRANSISTOR PC MNT TO-3 |
- | Transistor, TO-3 | 3 (Oval) | - | Chassis Mount | Closed Frame | Tin | - |
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558-10-652M35-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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558-10-652M35-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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115-93-318-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 18PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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518-77-652M35-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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214-99-624-01-670800 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN CLOSED FRAME SMD |
214 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Surface Mount | Closed Frame | Tin-Lead | 200µin (5.08µm) |
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518-77-652M35-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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69802-168LF |
FCI |
PLCC SOCKET 68POS TIN SMT |
- | Chip Carrier, PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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D00-044-490-001 |
EDAC Inc |
PLCC SKT 44POS SMD TIN/LEAD |
D00 | Chip Carrier, PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin-Lead | 150µin (3.81µm) |
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24-6518-10 |
Aries Electronics |
24 PIN SOLDER TAIL DIP .600 CTR. |
518 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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8118PF303 |
Aavid Thermalloy |
POWER TRANSISTOR SOCKET |
8180 | Transistor, TO-3 | 4 (Oval) | - | Through Hole | Closed Frame | Tin | - |
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4601 |
Keystone Electronics |
SOCKET FOR .090" TO-3 CASE |
- | Transistor, TO-3 | 3 (Oval) | - | Chassis Mount | Closed Frame | Tin | - |
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08-2513-10 |
Aries Electronics |
SERIES 513 LO-PRO W/SOLDER TAIL |
* | | | | | | | |
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110-41-632-41-001000 |
Mill-Max Manufacturing Corp. |
CONN DIP OPEN FRAME .015-.025 |
110...001 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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8180-E1 |
Aavid Thermalloy |
SOLERABLE TRANSISTOR MOUNT |
8180 | Transistor, TO-3 | 4 (Oval) | - | Through Hole | Closed Frame | Tin | - |
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8114LB603 REV J |
Aavid Thermalloy |
POWER TRANSISTOR SOCKET |
8180 | Transistor, TO-3 | 4 (Oval) | - | Through Hole | Closed Frame | Tin | - |
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110-99-648-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 48PIN MS TIN/TIN .600 |
110...001 | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin-Lead | 200µin (5.08µm) |
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10-3513-10 |
Aries Electronics |
SERIES 513 LO-PRO W/SOLDER TAIL |
* | | | | | | | |
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111-93-624-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24DIP .600 TIN |
111 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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28-3518-10 |
Aries Electronics |
518 OPN FRM COLLET SCKT SLDR TAI |
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16-3518-102 |
Aries Electronics |
518 OPN FRM CAP SOCKET SLDR TAIL |
* | | | | | | | |
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115-43-324-41-003000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN LOW PROFILE .300 |
115...003 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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20-3518-102 |
Aries Electronics |
518 OPN FRM CAP SOCKET SLDR TAIL |
* | | | | | | | |
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115-43-624-41-003000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN LOW PROFILE .600 |
115...003 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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08-6820-90C |
Aries Electronics |
800 VERTISOCKET HORIZONTAL MOUNT |
* | | | | | | | |
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20-3501-30 |
Aries Electronics |
501 DIP TEST SCKT SOLDER TAIL |
* | | | | | | | |
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115-43-624-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN LOW PROFILE .600 |
115...001 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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28-3518-101 |
Aries Electronics |
518 OPN FRM CAP SOCKET SLDR TAIL |
* | | | | | | | |
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28-6518-101 |
Aries Electronics |
518 OPN FRM CAP SOCKET SLDR TAIL |
* | | | | | | | |
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115-43-422-41-003000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 22PIN LOW PROFILE .400 |
115...003 | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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10-2820-90C |
Aries Electronics |
800 VERTISOCKET HORIZONTAL MOUNT |
* | | | | | | | |
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115-43-324-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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12-820-90C |
Aries Electronics |
800 VERTISOCKET HORIZONTAL MOUNT |
* | | | | | | | |
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10-4823-90C |
Aries Electronics |
800 VERTISOCKET HORIZONTAL MOUNT |
* | | | | | | | |
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214-99-640-01-670800 |
Mill-Max Manufacturing Corp. |
IC SOCKET 40PIN CLOSED FRAME SMD |
214 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Surface Mount | Closed Frame | Tin-Lead | 200µin (5.08µm) |
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40-9513-10 |
Aries Electronics |
SERIES 513 LO-PRO W/SOLDER TAIL |
* | | | | | | | |
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111-93-632-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 32DIP .600 TIN |
111 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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10-2810-90T |
Aries Electronics |
800 VERTISOCKET VERTICAL MOUNT |
* | | | | | | | |