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Part Number |
Manufacturer |
Description |
Series | Type | Number of Positions or Pins (Grid) | Pitch | Mounting Type | Features | Contact Finish | Contact Finish Thickness |
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558-10-356M26-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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1825108-2 |
TE Connectivity |
CONN IC SOCKET 28POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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558-10-357M19-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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558-10-360M19-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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643641-6 |
TE Connectivity |
IC SOCKET SIP 9POS .100 TIN |
Diplomate DL, AMP | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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550-10-388M26-001152 |
Preci-Dip |
BGA SOLDER TAIL |
* | | | | | | | |
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115-43-316-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 16PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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550-10-560M33-001166 |
Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD |
* | | | | | | | |
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514-87-560M33-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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1825108-1 |
TE Connectivity |
CONN IC SOCKET 24POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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514-83-456M26-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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940-44-084-17-400000 |
Mill-Max Manufacturing Corp. |
CONN SOCKET PLCC 84POS SMD |
940 | Chip Carrier, PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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558-10-352M26-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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518-77-352M26-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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BU180Z-178-HT |
On Shore Technology Inc |
CONN SOCKET IC 18-PIN SMD |
BU-178HT | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Surface Mount | Open Frame | Gold | 78.7µin (2.00µm) |
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558-10-356M26-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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643646-1 |
TE Connectivity |
CONN IC SOCKET 14POS SIP TIN |
Diplomate DL, AMP | SIP | 14 (1 x 14) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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550-10-400M20-000152 |
Preci-Dip |
BGA SOLDER TAIL |
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558-10-357M19-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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AR24-HZL/7/01-TT-R |
Assmann WSW Components |
IC SOCKET .300 24 DIP GOLD |
- | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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550-10-576M30-001166 |
Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD |
* | | | | | | | |
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518-77-356M26-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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AR24-HZL/01-TT-R |
Assmann WSW Components |
IC SOCKET .600 24 DIP GOLD |
- | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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518-77-357M19-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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AR14-HZL/07-TT-R |
Assmann WSW Components |
IC SOCKET .300 14 DIP GOLD |
- | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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514-87-576M30-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
* | | | | | | | |
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518-77-352M26-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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115-93-320-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 20PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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558-10-360M19-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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115-43-318-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 18PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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518-77-360M19-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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518-77-356M26-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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AR48-HZL-TT-R |
Assmann WSW Components |
IC SOCKET MACH PIN ST 48POS TIN |
- | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | - |
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518-77-357M19-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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123-43-308-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 8 PIN WIRE WRAP .300 |
123 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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558-10-388M26-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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514-83-478M26-131148 |
Preci-Dip |
BGA SURFACE MOUNT |
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643650-1 |
TE Connectivity |
CONN IC SOCKET 18POS SIP TIN |
Diplomate DL, AMP | SIP | 18 (1 x 18) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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514-83-480M29-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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643652-6 |
TE Connectivity |
CONN SOCKET SIP 20POS .100 TIN |
Diplomate DL, AMP | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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518-77-360M19-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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550-10-600M35-001166 |
Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD |
* | | | | | | | |
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1825109-2 |
TE Connectivity |
CONN IC SOCKET 28POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 15µin (0.38µm) |
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514-87-600M35-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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115-43-320-41-003000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 20PIN LOW PROFILE .300 |
115...003 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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550-10-420M26-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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558-10-400M20-000101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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115-43-320-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 20PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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514-83-500M30-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
* | | | | | | | |
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AR16-HZL/07-TT-R |
Assmann WSW Components |
IC SOCKET .300 16 DIP GOLD |
- | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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550-10-432M31-001152 |
Preci-Dip |
BGA SOLDER TAIL |
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514-83-504M29-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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111-43-320-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 20PIN .300 SOLDER TAIL |
111 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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558-10-388M26-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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111-93-324-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24DIP .300 TIN |
111 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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518-77-388M26-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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917-93-210-41-005000 |
Mill-Max Manufacturing Corp. |
SOCKET TRANSISTOR 10 PIN TO-100 |
917 | Transistor, TO-100 | 10 (Round) | - | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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558-10-420M26-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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518-77-388M26-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
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115-93-624-41-003000 |
Mill-Max Manufacturing Corp. |
24 PIN LOW PROFILE IC SOCKET .60 |
115...003 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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514-83-520M31-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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5-1571552-0 |
TE Connectivity |
CONN SOCKET 32POS DIP GOLD T/H |
800 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 20µin (0.51µm) |
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558-10-400M20-000104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
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518-77-400M20-000105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
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123-13-308-41-001000 |
Mill-Max Manufacturing Corp. |
W/W IC SOCKET 8 PIN .300 GOLD |
123 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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550-10-652M35-001166 |
Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD |
* | | | | | | | |
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115-93-624-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN LOW PROFILE .600 |
115...001 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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514-87-652M35-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
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550-10-456M26-001152 |
Preci-Dip |
BGA SOLDER TAIL |
* | | | | | | | |
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115-93-324-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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558-10-432M31-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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518-77-400M20-000106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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214-99-632-01-670800 |
Mill-Max Manufacturing Corp. |
IC SOCKET 32PIN CLOSED FRAME SMD |
214 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Surface Mount | Closed Frame | Tin-Lead | 200µin (5.08µm) |
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558-10-420M26-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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AR40-HZL/01-TT-R |
Assmann WSW Components |
IC SOCKET .600 40 DIP GOLD |
- | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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518-77-420M26-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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550-10-478M26-131152 |
Preci-Dip |
BGA SOLDER TAIL |
* | | | | | | | |
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115-43-632-41-003000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 32PIN LOW PROFILE .600 |
115...003 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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558-10-500M30-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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550-10-480M29-001152 |
Preci-Dip |
BGA SOLDER TAIL |
* | | | | | | | |
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AR28-HZL/7/07-TT-R |
Assmann WSW Components |
IC SOCKET .300 28 DIP GOLD |
- | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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514-83-560M33-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
* | | | | | | | |
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123-13-314-41-001000 |
Mill-Max Manufacturing Corp. |
W/W IC SOCKET 14 PIN .300 GOLD |
123 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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558-10-456M26-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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518-77-420M26-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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540-44-084-17-400000 |
Mill-Max Manufacturing Corp. |
IC SOCKET PLCC 84POS SMT |
540 | Chip Carrier, PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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558-10-504M29-001101 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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123-43-324-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24 PIN WIRE WRAP .300 |
123 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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558-10-432M31-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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558-10-478M26-131104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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110-43-324-41-801000 |
Mill-Max Manufacturing Corp. |
IC SOCKET W/CAP 24 PIN .300 |
110...801 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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518-77-432M31-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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110-43-964-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 64 PIN .900 GOLD |
110...001 | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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518-77-478M26-131105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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558-10-480M29-001104 |
Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
* | | | | | | | |
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299-43-608-10-002000 |
Mill-Max Manufacturing Corp. |
IC SOCKET RT ANG 8PIN DIP .600 |
299 | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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518-77-480M29-001105 |
Preci-Dip |
PGA SOLDER TAIL 1.27MM |
* | | | | | | | |
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299-43-320-10-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET RT ANG 20PIN DIP .300 |
299 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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514-83-576M30-001148 |
Preci-Dip |
BGA SURFACE MOUNT |
* | | | | | | | |
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518-77-432M31-001106 |
Preci-Dip |
PGA SURFACE MOUNT 1.27MM |
* | | | | | | | |