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Part Number |
Manufacturer |
Description |
Series | Type | Number of Positions or Pins (Grid) | Pitch | Mounting Type | Features | Contact Finish | Contact Finish Thickness |
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115-43-632-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 32PIN LOW PROFILE .600 |
115...001 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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123-13-328-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 3 LVL .300 28POS |
123 | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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110-93-314-41-801000 |
Mill-Max Manufacturing Corp. |
IC SOCKET W/CAP TIN MS ST 14 PIN |
110...801 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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123-13-428-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 3 LVL .400 28POS |
123 | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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540-44-068-17-400000 |
Mill-Max Manufacturing Corp. |
IC SOCKET PLCC 68POS SMT |
540 | Chip Carrier, PLCC | 68 (4 x 17) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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127-93-640-41-002000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN SHRINK .600 40POS |
127 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.070" (1.78mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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110-93-316-41-801000 |
Mill-Max Manufacturing Corp. |
IC SOCKET W/CAP TIN MS ST 16 PIN |
110...801 | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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122-13-320-41-801000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN W/CAP .300 20POS |
122...801 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Wire Wrap | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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110-43-314-41-801000 |
Mill-Max Manufacturing Corp. |
IC SOCKET W/CAP 14 PIN .300 |
110...801 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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110-13-650-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN FRAME .600 50POS |
110...001 | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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299-93-310-11-001000 |
Mill-Max Manufacturing Corp. |
SOCKET RT ANGLE 10PIN DIP .300 |
299 | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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116-93-650-41-003000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 50POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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115-93-640-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 40PIN LOW PROFILE .600 |
115...001 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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116-93-642-41-003000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 42POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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110-93-648-41-001000 |
Mill-Max Manufacturing Corp. |
48 PIN IC SOCKET GOLD .600 |
110...001 | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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123-13-320-41-801000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN W/CAP .300 20POS |
123...801 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Wire Wrap | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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110-43-648-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 48 PIN .600 GOLD |
110...001 | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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217-93-764-41-005000 |
Mill-Max Manufacturing Corp. |
SOCKET IC CLOSED SHRNK.750 64POS |
217 | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | 0.070" (1.78mm) | Wire Wrap | Closed Frame | Gold | 30µin (0.76µm) |
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550-80-132-13-041101 |
Preci-Dip |
PGA SOLDER TAIL |
* | | | | | | | |
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2-1437530-8 |
TE Connectivity |
CONN IC SOCKET 10 POS GOLD |
500 | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | - |
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550-80-132-14-071101 |
Preci-Dip |
PGA SOLDER TAIL |
* | | | | | | | |
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115-43-640-41-003000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 40PIN LOW PROFILE .600 |
115...003 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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114-93-950-41-117000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN .900 50POS SMD |
114 | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Surface Mount | Open Frame | Gold | 30µin (0.76µm) |
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110-13-314-41-801000 |
Mill-Max Manufacturing Corp. |
IC SOCKET W/CAP GOLD MS ST 14PIN |
110...801 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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115-43-640-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 40PIN LOW PROFILE .600 |
115...001 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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111-93-640-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 40DIP .600 TIN |
111 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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117-93-428-41-005000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 28 PIN .400 |
117 | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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299-43-310-10-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET RT ANG 10PIN DIP .300 |
299 | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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110-93-324-41-801000 |
Mill-Max Manufacturing Corp. |
IC SOKT W/CAP TIN MS ST .300 24P |
110...801 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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110-13-316-41-801000 |
Mill-Max Manufacturing Corp. |
IC SOCKET W/CAP GOLD MS ST 16PIN |
110...801 | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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299-43-312-11-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET RT ANG 12PIN DIP .300 |
299 | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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1-1437531-7 |
TE Connectivity |
CONN SOCKET DIP 14POS GOLD T/H |
500 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | - |
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643657-1 |
TE Connectivity |
CONN IC SOCKET 25POS SIP TIN |
Diplomate DL, AMP | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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110-13-640-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 40 PIN .600 GOLD |
110...001 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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1437536-2 |
TE Connectivity |
CONN SOCKET DIP 16POS GOLD T/H |
500 | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | - |
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123-93-628-41-001000 |
Mill-Max Manufacturing Corp. |
28 PIN W/W IC SOCKET GOLD .600 |
123 | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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299-43-314-11-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET RT ANG 14PIN DIP .300 |
299 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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299-43-316-11-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET RT ANG 16PIN DIP .300 |
299 | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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117-93-642-41-005000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 42 PIN .600 |
117 | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.070" (1.78mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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299-43-314-10-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET RT ANG 14PIN DIP .300 |
299 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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299-43-612-10-002000 |
Mill-Max Manufacturing Corp. |
IC SOCKET RT ANG 12PIN DIP .600 |
299 | DIP, 0.6" (15.24mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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123-93-640-41-001000 |
Mill-Max Manufacturing Corp. |
40 PIN W/W IC SOCKET GOLD .600 |
123 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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299-93-320-10-001000 |
Mill-Max Manufacturing Corp. |
SOCKET RT ANGLE 20PIN DIP .300 |
299 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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117-93-656-41-005000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 56 PIN .600 |
117 | DIP, 0.6" (15.24mm) Row Spacing | 56 (2 x 28) | 0.070" (1.78mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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123-43-640-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 40 PIN WIRE WRAP .600 |
123 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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117-43-764-41-005000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 64 PIN .75 HI DENSITY |
117 | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | 0.070" (1.78mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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299-93-618-10-002000 |
Mill-Max Manufacturing Corp. |
SOCKET RT ANGLE 18PIN DIP .600 |
299 | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole, Right Angle, Horizontal | Closed Frame | Gold | 30µin (0.76µm) |
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1437508-7 |
TE Connectivity |
CONN SOCKET TRANSIST 3POS TO-5 |
8058 | Transistor, TO-5 | 3 (Round) | - | Through Hole | Closed Frame | Gold | - |
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1-1437504-9 |
TE Connectivity |
CONN SOCKET 3POS SLD POCKET GOLD |
8060 | Transistor, TO-5 | 3 (Round) | - | Through Hole | Closed Frame | Gold | - |
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1-1437508-4 |
TE Connectivity |
CONN SOCKET TRANSIST 4POS TO-5 |
8058 | Transistor, TO-5 | 4 (Round) | - | Panel Mount | Closed Frame | Gold | - |
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1-1437508-6 |
TE Connectivity |
CONN SOCKET TRANSIST 8POS TO-5 |
8058 | Transistor, TO-5 | 8 (Round) | - | Through Hole | Closed Frame | Gold | - |
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222-3343-00-0602J |
3M |
SOCKET ZIP DIP 22 POS GOLD |
Textool™ | DIP, ZIF (ZIP) | 22 (2 x 11) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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214-7390-55-1902 |
3M |
SOCKET SOIC 14POS LIDDED |
Textool™ | SOIC | 14 (2 x 7) | 0.050" (1.27mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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2-821949-4 |
TE Connectivity |
CONN IC SOCKET HOUSING 100POS |
AMP | PQFP | 100 (4 x 25) | 0.050" (1.27mm) | Through Hole | Closed Frame | Tin-Lead | 200µin (5.08µm) |
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MS03 |
Apex Microtechnology |
SOCKET PKG 8P TO-3 |
Apex Precision Power® | Transistor, TO-3 | 8 (Oval) | - | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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A18-LC-TR-R |
Assmann WSW Components |
IC SOCKET ST 18POS TIN RETENTIVE |
- | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | - |
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A20-LC-TR-R |
Assmann WSW Components |
IC SOCKET ST 20POS TIN RETENTIVE |
- | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | - |
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4828-6004-CP |
3M |
SOCKET IC OPEN FRAME 28POS .6 |
4800 | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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A06-LCG-T-R |
Assmann WSW Components |
IC SOCKET ST 6POS GOLD |
- | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | - |
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A-CCS20-Z-SM-R |
Assmann WSW Components |
IC SOCKET PLCC 20POS TIN SMD |
- | Chip Carrier, PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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A-CCS28-Z-SM-R |
Assmann WSW Components |
IC SOCKET PLCC 28POS TIN SMD |
- | Chip Carrier, PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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2-641267-3 |
TE Connectivity |
CONN SOCKET VERT 28 POS TIN DIP |
Diplomate DL, AMP | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole, Press-Fit | Closed Frame | Tin | - |
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2-382465-3 |
TE Connectivity |
20 POS DIP HI TEMP PHBZ |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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A-CCS32-Z-R |
Assmann WSW Components |
IC SOCKET PLCC 32POS TIN |
- | Chip Carrier, PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Through Hole | Closed Frame | Tin | 150µin (3.81µm) |
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69802-132LF |
FCI |
PLCC SOCKET 32POS TIN SMT |
- | Chip Carrier, PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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8428-21B1-RK-TR |
3M |
IC SOCKET 28POS PLCC SMD |
8400 | Chip Carrier, PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 160µin (4.06µm) |
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8428-21B1-RK-TR |
3M |
IC SOCKET 28POS PLCC SMD |
8400 | Chip Carrier, PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 160µin (4.06µm) |
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8428-21B1-RK-TR |
3M |
IC SOCKET 28POS PLCC SMD |
8400 | Chip Carrier, PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 160µin (4.06µm) |
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BU060Z-178-HT |
On Shore Technology Inc |
CONN SOCKET IC 6-PIN SMD |
BU-178HT | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Surface Mount | Open Frame | Gold | 78.7µin (2.00µm) |
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08-3518-10 |
Aries Electronics |
8 PIN SOLDER TAIL DIP SOCKET |
518 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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116-93-636-41-007000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 36POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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8420-21B1-RK-TP |
3M |
IC SOCKET 20POS PLCC SMD |
8400 | Chip Carrier, PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 160µin (4.06µm) |
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104-13-432-41-780000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN FRAME .400 32POS |
104 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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2-382470-3 |
TE Connectivity |
CONN SOCKET VERT 32 POS TIN PCB |
Diplomate DL, AMP | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole, Right Angle, Vertical | Closed Frame | Tin | - |
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104-13-632-41-780000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN FRAME .600 32POS |
104 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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16-3518-10 |
Aries Electronics |
16 PIN SOLDER TAIL DIP SOCKET |
518 | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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122-13-432-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 2 LVL .400 32POS |
122 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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20-3518-10 |
Aries Electronics |
20 PIN SOLDER TAIL DIP SOCKET |
518 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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122-13-632-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 2 LVL .600 32POS |
122 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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8484-21B1-RK-TP |
3M |
IC SOCKET 84POS PLCC SMD |
8400 | Chip Carrier, PLCC | 84 (4 x 21) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 160µin (4.06µm) |
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123-13-424-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 3 LVL .400 24POS |
123 | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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18-3518-10 |
Aries Electronics |
18 PIN SOLDER TAIL DIP SOCKET |
518 | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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123-93-636-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 3 LVL .600 36POS |
123 | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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115-93-318-41-003000 |
Mill-Max Manufacturing Corp. |
18PIN LOW PROFILE IC SOCKET .300 |
115...003 | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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110-93-964-41-105000 |
Mill-Max Manufacturing Corp. |
SOCKET IC GULLWNG .900 64POS SMD |
110...105 | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Surface Mount | Open Frame | Gold | 30µin (0.76µm) |
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111-43-316-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 16PIN .300 SOLDER TAIL |
111 | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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104-13-642-41-780000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN FRAME .600 42POS |
104 | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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115-43-318-41-003000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 18PIN LOW PROFILE .300 |
115...003 | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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114-93-964-41-117000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN .900 64POS SMD |
114 | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Surface Mount | Open Frame | Gold | 30µin (0.76µm) |
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AR32-HZL/01-TT-R |
Assmann WSW Components |
IC SOCKET .600 32 DIP GOLD |
- | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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116-93-432-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .400 32POS |
116 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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110-44-648-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 48PIN MS TIN/TIN .600 |
110...001 | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 200µin (5.08µm) |
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116-93-632-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 32POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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540-44-020-17-400000 |
Mill-Max Manufacturing Corp. |
IC SOCKET PLCC 20POS SMT |
540 | Chip Carrier, PLCC | 20 (4 x 5) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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116-93-950-41-003000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .900 50POS |
116 | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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614-43-314-31-012000 |
Mill-Max Manufacturing Corp. |
CARRIER W/ SOCKETS 14POS GD/TIN |
614 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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127-93-428-41-003000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN SHRINK .400 28POS |
127 | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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111-43-624-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 24PIN .600 SOLDER TAIL |
111 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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127-93-628-41-003000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN SHRINK .600 28POS |
127 | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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28-6518-10 |
Aries Electronics |
28 PIN SOLDER TAIL DIP SOCKET |
518 | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |