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Part Number |
Manufacturer |
Description |
Series | Type | Number of Positions or Pins (Grid) | Pitch | Mounting Type | Features | Contact Finish | Contact Finish Thickness |
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123-93-432-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 3 LVL .400 32POS |
123 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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4820-3004-CP |
3M |
SOCKET IC OPEN FRAME 20POS .3 |
4800 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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612-93-432-41-001000 |
Mill-Max Manufacturing Corp. |
CARRIER W/ SOCKETS SLDRTL 32POS |
612 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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1825373-2 |
TE Connectivity |
CONN IC SOCKET 8 POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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122-13-324-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 2 LVL .300 24POS |
122 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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1825093-1 |
TE Connectivity |
CONN IC SOCKET 6 POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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122-13-424-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 2 LVL .400 24POS |
122 | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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A22-LC-T2-R |
Assmann WSW Components |
IC SOCKET 22POS TIN .400 SPACING |
- | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | - |
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122-13-624-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 2 LVL .600 24POS |
122 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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4824-6000-CP |
3M |
SOCKET IC OPEN FRAME 24POS .6 |
4800 | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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6-1437504-3 |
TE Connectivity |
TRANS SOCKET |
8080 | Transistor, TO-3 | 3 (Oval) | - | Chassis Mount | Closed Frame | Tin | 200µin (5.08µm) |
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DILB40P-223TLF |
FCI |
IC SOCKET 40POS .100 DIP |
- | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 100µin (2.54µm) |
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121-13-432-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 1 LVL .400 32POS |
121 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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4828-6000-CP |
3M |
SOCKET IC OPEN FRAME 28POS .6 |
4800 | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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121-13-632-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 1 LVL .600 32POS |
121 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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2-641260-4 |
TE Connectivity |
CONN IC SOCKET 8 POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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4840-6004-CP |
3M |
SOCKET IC OPEN FRAME 40POS .6 |
4800 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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127-93-428-41-002000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN SHRINK .400 28POS |
127 | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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A-CCS32-Z-SM-R |
Assmann WSW Components |
IC SOCKET PLCC 32POS TIN SMD |
- | Chip Carrier, PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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127-93-628-41-002000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN SHRINK .600 28POS |
127 | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.070" (1.78mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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4824-3000-CP |
3M |
SOCKET IC OPEN FRAME 24POS .3 |
4800 | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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550-80-114-13-062101 |
Preci-Dip |
PGA SOLDER TAIL |
* | | | | | | | |
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A14-LCG-T-R |
Assmann WSW Components |
IC SOCKET STRAIGHT 14POS GOLD |
- | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | - |
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127-93-430-41-003000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN SHRINK .400 30POS |
127 | DIP, 0.4" (10.16mm) Row Spacing | 30 (2 x 15) | 0.070" (1.78mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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4840-6000-CP |
3M |
SOCKET IC OPEN FRAME 40POS .6 |
4800 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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28-526-11 |
Aries Electronics |
SOCKET 28 PIN ZIF LO PROFILE GOL |
Lo-PRO®file, 526 | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 10µin (0.25µm) |
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4832-6000-CP |
3M |
SOCKET IC OPEN FRAME 32POS .6 |
4800 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 35µin (0.90µm) |
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1761503-1 |
TE Connectivity |
CONN SKT MICRO PGA 940POS SMD |
- | PGA | 940 (30 x 30) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Gold | 30µin (0.76µm) |
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2-641609-1 |
TE Connectivity |
CONN IC SOCKET 14POS DIP TIN |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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614-93-652-31-018000 |
Mill-Max Manufacturing Corp. |
CARRIER W/ SOCKETS LOWPRO 52POS |
614 | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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1-1825093-2 |
TE Connectivity |
CONN IC SOCKET 8 POS DIP 30AU |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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605-93-640-11-480000 |
Mill-Max Manufacturing Corp. |
CARRIER W/ SOCKETS LOWPRO 40POS |
605 | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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SA143040 |
On Shore Technology Inc |
CONN SOCKET IC 14-PIN T/H |
- | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | Flash |
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546-87-133-14-002135 |
Preci-Dip |
PGA PRESS FIT |
* | | | | | | | |
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546-87-133-14-002136 |
Preci-Dip |
PGA PRESS FIT |
* | | | | | | | |
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1825093-3 |
TE Connectivity |
CONN IC SOCKET 14POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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126-93-318-41-003000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN PLUGBL .300 18POS |
126 | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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SA183000 |
On Shore Technology Inc |
CONN SOCKET IC 18-PIN T/H |
- | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | Flash |
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AR06-HZL/01-TT-R |
Assmann WSW Components |
IC SOCKET .300 6 DIP GOLD |
- | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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110-13-950-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN FRAME .900 50POS |
110...001 | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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115-93-952-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN LOWPRO .900 52POS |
115...001 | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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2-641261-1 |
TE Connectivity |
CONN SOCKET VERT 14 POS TIN DIP |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole, Right Angle, Vertical | Closed Frame | Tin | - |
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SA163040 |
On Shore Technology Inc |
CONN SOCKET IC 16-PIN T/H |
- | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | Flash |
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126-93-432-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN PLUGBL .400 32POS |
126 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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126-93-632-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN PLUGBL .600 32POS |
126 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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2-641615-3 |
TE Connectivity |
CONN IC SOCKET 28POS DIP TIN |
Diplomate DL, AMP | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | - |
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510-83-221-18-091101 |
Preci-Dip |
DIL SOLDER TAIL 2.54MM |
* | | | | | | | |
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SA183040 |
On Shore Technology Inc |
CONN SOCKET IC 18-PIN T/H |
- | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | Flash |
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116-93-650-41-006000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 50POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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A20-LCG-T-R |
Assmann WSW Components |
IC SOCKET STRAIGHT 20POS GOLD |
- | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | - |
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116-93-950-41-006000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .900 50POS |
116 | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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2-382568-8 |
TE Connectivity |
CONN SOCKET VERT 28 POS TIN |
Diplomate DL, AMP | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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111-93-950-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN LONGTL .900 50POS |
111 | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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382437-1 |
TE Connectivity |
CONN IC SOCKET 3POS SIP TIN |
Diplomate DL, AMP | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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123-13-322-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 3 LVL .300 22POS |
123 | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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SA243000 |
On Shore Technology Inc |
CONN SOCKET IC 24-PIN T/H |
- | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | Flash |
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2-640358-4 |
TE Connectivity |
CONN IC SOCKET 16POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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123-13-422-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN 3 LVL .400 22POS |
123 | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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110-41-308-41-001000 |
Mill-Max Manufacturing Corp. |
CONN DIP OPEN FRAME .015-.025 |
110...001 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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126-93-328-41-002000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN PLUGBL .300 28POS |
126 | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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210-93-308-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 8DIP .300 TIN |
210 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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126-93-428-41-002000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN PLUGBL .400 28POS |
126 | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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126-93-628-41-002000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN PLUGBL .600 28POS |
126 | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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210-43-308-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 8PIN .300 SOLDER TAIL |
210 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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116-93-642-41-006000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 42POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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2-640357-4 |
TE Connectivity |
CONN IC SOCKET 14POS DIP 15AU |
Diplomate DL, AMP | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 15µin (0.38µm) |
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A-CCS52-Z-R |
Assmann WSW Components |
IC SOCKET PLCC 52POS TIN |
- | Chip Carrier, PLCC | 52 (4 x 13) | 0.050" (1.27mm) | Through Hole | Closed Frame | Tin | 150µin (3.81µm) |
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111-93-964-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN LONGTL .900 64POS |
111 | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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8428-11B1-RK-TP |
3M |
IC SOCKET 28POS PLCC THRU-HOLE |
8400 | Chip Carrier, PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Through Hole | Closed Frame | Tin | 160µin (4.06µm) |
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104-13-432-41-770000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN FRAME .400 32POS |
104 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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115-93-308-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 8PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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104-13-632-41-770000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN FRAME .600 32POS |
104 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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110-99-318-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 18PIN MS TIN/TIN .300 |
110...001 | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin-Lead | 200µin (5.08µm) |
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210-93-964-41-001000 |
Mill-Max Manufacturing Corp. |
SOCKET IC CLOSED FRM .900 64POS |
210 | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Through Hole | Closed Frame | Gold | 30µin (0.76µm) |
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8432-21B1-RK-TP |
3M |
IC SOCKET 32POS PLCC SMD |
8400 | Chip Carrier, PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 160µin (4.06µm) |
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324-13-120-41-002000 |
Mill-Max Manufacturing Corp. |
SOCKET 4 LEVEL WRAPOST SIP 20POS |
324 | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Wire Wrap | Closed Frame | Gold | 30µin (0.76µm) |
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151-10-640-00-016101 |
Preci-Dip |
DIL SOLDER TAIL 2.54MM |
* | | | | | | | |
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382438-1 |
TE Connectivity |
CONN IC SOCKET 4POS SIP TIN |
Diplomate DL, AMP | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Through Hole | Closed Frame | Tin | - |
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116-93-432-41-008000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .400 32POS |
116 | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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4-1571552-3 |
TE Connectivity |
CONN SOCKET DIP 8POS VERT GOLD |
800 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 20µin (0.51µm) |
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116-93-632-41-008000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 32POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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69802-128LF |
FCI |
PLCC SOCKET 28POS TIN SMT |
- | Chip Carrier, PLCC | 28 (4 x 7) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 150µin (3.81µm) |
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116-93-642-41-008000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 42POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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SA326000 |
On Shore Technology Inc |
CONN SOCKET IC 32-PIN T/H |
- | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | Flash |
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110-44-320-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 20PIN MS TIN/TIN .300 |
110...001 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Tin | 200µin (5.08µm) |
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116-93-636-41-003000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN ELEVTD .600 36POS |
116 | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Wire Wrap | Open Frame | Gold | 30µin (0.76µm) |
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115-43-308-41-001000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 8PIN LOW PROFILE .300 |
115...001 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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123-93-322-41-801000 |
Mill-Max Manufacturing Corp. |
SOCKET IC OPEN W/CAP .300 22POS |
123...801 | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Wire Wrap | Open Frame, Decoupling Capacitor | Gold | 30µin (0.76µm) |
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2-1571552-6 |
TE Connectivity |
CONN SOCKET DIP 20POS T/H |
800 | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | Flash |
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110-93-650-41-105000 |
Mill-Max Manufacturing Corp. |
SOCKET IC GULLWNG .600 50POS SMD |
110...105 | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Surface Mount | Open Frame | Gold | 30µin (0.76µm) |
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4-1571552-2 |
TE Connectivity |
CONN SOCKET 14POS DIP GOLD T/H |
800 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 20µin (0.51µm) |
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110-93-950-41-105000 |
Mill-Max Manufacturing Corp. |
SOCKET IC GULLWNG .900 50POS SMD |
110...105 | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Surface Mount | Open Frame | Gold | 30µin (0.76µm) |
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510-83-223-18-002101 |
Preci-Dip |
DIL SOLDER TAIL 2.54MM |
* | | | | | | | |
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510-83-223-18-091101 |
Preci-Dip |
DIL SOLDER TAIL 2.54MM |
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115-43-308-41-003000 |
Mill-Max Manufacturing Corp. |
IC SOCKET 8PIN LOW PROFILE .300 |
115...003 | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 30µin (0.76µm) |
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510-83-223-18-092101 |
Preci-Dip |
DIL SOLDER TAIL 2.54MM |
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110-41-314-41-001000 |
Mill-Max Manufacturing Corp. |
CONN DIP OPEN FRAME .015-.025 |
110...001 | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Through Hole | Open Frame | Gold | 10µin (0.25µm) |
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510-83-223-18-093101 |
Preci-Dip |
DIL SOLDER TAIL 2.54MM |
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510-83-223-18-094101 |
Preci-Dip |
DIL SOLDER TAIL 2.54MM |
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8444-21A1-RK-TP |
3M |
IC SOCKET 44POS PLCC SMD W/POST |
8400 | Chip Carrier, PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Surface Mount | Closed Frame | Tin | 160µin (4.06µm) |