DS34T108GN+
- Description：
- IC TDM OVER PACKET 484HSBGA
- Manufacturer：
- Maxim Integrated
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Product Information
- Category
- Specialized ICs
- Packaging
- Tray
- Series
- -
- Type
- TDM (Time Division Multiplexing)
- Applications
- Data Transport
- Mounting Type
- Surface Mount
- Package / Case
- 484-BGA Exposed Pad
- Supplier Device Package
- 484-HSBGA (23x23)
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