DS34S132GN+
- Description：
- IC TDM OVER PACKET 676-BGA
- Manufacturer：
- Maxim Integrated
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Product Information
- Category
- Interface - Telecom
- Packaging
- Tray
- Series
- -
- Function
- TDM-over-Packet (TDMoP)
- Interface
- TDMoP
- Number of Circuits
- 1
- Voltage - Supply
- 1.8V, 3.3V
- Current - Supply
- -
- Power (Watts)
- -
- Operating Temperature
- -40°C ~ 85°C
- Mounting Type
- Surface Mount
- Package / Case
- 676-BGA
- Supplier Device Package
- 676-PBGA (27x27)
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