HF115AC-0.0055-AC-105
- Description：
- THERM PAD SIP PKG W/ADH HI-FLOW
- Manufacturer：
- Bergquist
- Buy HF115AC-0.0055-AC-105 at Hotenda Tech . Hotenda Tech has the largest selection of electronic components, parts and suppliers . All products details and free PDF download of HF115AC-0.0055-AC-105 can be provided at http://www.hotenda.com/product-tags/HF115AC-0.0055-AC-105.html
Product Information
- Category
- Thermal - Pads, Sheets
- Series
- Hi-Flow® 115-AC
- Usage
- SIP
- Shape
- Rectangle
- Outline
- 36.83mm x 21.29mm
- Thickness
- 0.0055" (0.140mm)
- Material
- Phase Change Compound
- Adhesive
- Adhesive - One Side
- Backing, Carrier
- Fiberglass
- Color
- Gray
- Thermal Resistivity
- 0.35°C/W
- Thermal Conductivity
- 0.8 W/m-K
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