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HF115AC-0.0055-AC-90

Description:
THERM PAD TO-218 W/ADH HI-FLOW
Manufacturer:
Bergquist
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HF115AC-0.0055-AC-90

Product Information

Category
Thermal - Pads, Sheets
Series
Hi-Flow® 115-AC
Usage
TO-218, TO-220, TO-247
Shape
Rectangle
Outline
21.84mm x 18.79mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8 W/m-K

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