BDN09-3CB
- Description：
- HEATSINK CPU .91" SQ
- Manufacturer：
- CTS Thermal Management Products
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Product Information
- Category
- Thermal - Heat Sinks
- Series
- BDN
- Type
- Top Mount
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method
- Thermal Tape, Adhesive (Not Included)
- Shape
- Square, Pin Fins
- Length
- 0.910" (23.11mm)
- Width
- 0.910" (23.11mm)
- Diameter
- -
- Height Off Base (Height of Fin)
- 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise
- -
- Thermal Resistance @ Forced Air Flow
- 9.6°C/W @ 400 LFM
- Thermal Resistance @ Natural
- 26.9°C/W
- Material
- Aluminum
- Material Finish
- Black Anodized
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