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BDN09-3CB

Description:
HEATSINK CPU .91" SQ
Manufacturer:
CTS Thermal Management Products
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BDN09-3CB

Product Information

Category
Thermal - Heat Sinks
Series
BDN
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.910" (23.11mm)
Width
0.910" (23.11mm)
Diameter
-
Height Off Base (Height of Fin)
0.355" (9.02mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
9.6°C/W @ 400 LFM
Thermal Resistance @ Natural
26.9°C/W
Material
Aluminum
Material Finish
Black Anodized

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