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LTN20069-T5

Description:
HEAT SINK BGA/PGA 16.5X16.5X8.9
Manufacturer:
Wakefield Thermal Solutions
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LTN20069-T5

Product Information

Category
Thermal - Heat Sinks
Series
-
Type
Board Level
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Fins
Length
0.650" (16.51mm)
Width
0.653" (16.59mm)
Diameter
-
Height Off Base (Height of Fin)
0.350" (8.89mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
Black Anodized

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