LTN20069-T5
- Description：
- HEAT SINK BGA/PGA 16.5X16.5X8.9
- Manufacturer：
- Wakefield Thermal Solutions
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Product Information
- Category
- Thermal - Heat Sinks
- Series
- -
- Type
- Board Level
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method
- Thermal Tape, Adhesive (Included)
- Shape
- Square, Fins
- Length
- 0.650" (16.51mm)
- Width
- 0.653" (16.59mm)
- Diameter
- -
- Height Off Base (Height of Fin)
- 0.350" (8.89mm)
- Power Dissipation @ Temperature Rise
- -
- Thermal Resistance @ Forced Air Flow
- -
- Thermal Resistance @ Natural
- -
- Material
- Aluminum
- Material Finish
- Black Anodized
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