BDN09-3CB/A01
- Description：
- HEATSINK CPU W/ADHESIVE .91"SQ
- Manufacturer：
- CTS Thermal Management Products
- Buy BDN09-3CB/A01 at Hotenda Tech . Hotenda Tech has the largest selection of electronic components, parts and suppliers . All products details and free PDF download of BDN09-3CB/A01 can be provided at http://www.hotenda.com/product-tags/BDN09-3CB%2FA01.html
Product Information
- Category
- Thermal - Heat Sinks
- Series
- BDN
- Type
- Top Mount
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method
- Thermal Tape, Adhesive (Included)
- Shape
- Square, Pin Fins
- Length
- 0.910" (23.11mm)
- Width
- 0.910" (23.11mm)
- Diameter
- -
- Height Off Base (Height of Fin)
- 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise
- -
- Thermal Resistance @ Forced Air Flow
- 9.6°C/W @ 400 LFM
- Thermal Resistance @ Natural
- 26.9°C/W
- Material
- Aluminum
- Material Finish
- Black Anodized
Customers Who Bought This Item Also Bought
Related keywords for BDN09-3CB/A01
- BDN09-3CB/A01 price
- BDN09-3CB/A01 distributor
- BDN09-3CB/A01 supplier
- BDN09-3CB/A01 pdf
- BDN09-3CB/A01 data sheet
- BDN09-3CB/A01 datasheet
- BDN09-3CB/A01 pdf datasheet
- Download BDN09-3CB/A01 datasheet
- BDN09-3CB/A01 image
- BDN09-3CB/A01 part
- BDN09-3CB/A01 component
- BDN09-3CB/A01 stock
- BDN09-3CB/A01 inventory
- Buy BDN09-3CB/A01