APF19-19-13CB
- Description：
- HEATSINK LOW-PROFILE FORGED
- Manufacturer：
- CTS Thermal Management Products
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Product Information
- Category
- Thermal - Heat Sinks
- Series
- APF
- Type
- Top Mount
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method
- Thermal Tape, Adhesive (Not Included)
- Shape
- Square, Fins
- Length
- 0.748" (19.00mm)
- Width
- 0.748" (19.00mm)
- Diameter
- -
- Height Off Base (Height of Fin)
- 0.500" (12.70mm)
- Power Dissipation @ Temperature Rise
- -
- Thermal Resistance @ Forced Air Flow
- 4.0°C/W @ 200 LFM
- Thermal Resistance @ Natural
- -
- Material
- Aluminum
- Material Finish
- Black Anodized
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