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655-53AB

Description:
HEATSINK CPU 40.6MM SQ H=.525
Manufacturer:
Wakefield Thermal Solutions
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655-53AB

Product Information

Category
Thermal - Heat Sinks
Series
655
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Shape
Square, Pin Fins
Length
1.600" (40.64mm)
Width
1.600" (40.64mm)
Diameter
-
Height Off Base (Height of Fin)
0.522" (13.27mm)
Power Dissipation @ Temperature Rise
4W @ 40°C
Thermal Resistance @ Forced Air Flow
2°C/W @ 400 LFM
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
Black Anodized

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