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BDN15-3CB/A01

Description:
HEATSINK CPU W/ADHESIVE 1.51"SQ
Manufacturer:
CTS Thermal Management Products
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BDN15-3CB/A01

Product Information

Category
Thermal - Heat Sinks
Series
BDN
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
1.51" (38.35mm)
Width
1.510" (38.35mm)
Diameter
-
Height Off Base (Height of Fin)
0.355" (9.02mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
4.5°C/W @ 400 LFM
Thermal Resistance @ Natural
15.1°C/W
Material
Aluminum
Material Finish
Black Anodized

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