BDN13-3CB/A01
- Description：
- HEATSINK CPU W/ADHESIVE 1.31"SQ
- Manufacturer：
- CTS Thermal Management Products
- Buy BDN13-3CB/A01 at Hotenda Tech . Hotenda Tech has the largest selection of electronic components, parts and suppliers . All products details and free PDF download of BDN13-3CB/A01 can be provided at http://www.hotenda.com/product-tags/BDN13-3CB%2FA01.html
Product Information
- Category
- Thermal - Heat Sinks
- Series
- BDN
- Type
- Top Mount
- Package Cooled
- Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method
- Thermal Tape, Adhesive (Included)
- Shape
- Square, Pin Fins
- Length
- 1.310" (33.27mm)
- Width
- 1.310" (33.27mm)
- Diameter
- -
- Height Off Base (Height of Fin)
- 0.355" (9.02mm)
- Power Dissipation @ Temperature Rise
- -
- Thermal Resistance @ Forced Air Flow
- 6.0°C/W @ 400 LFM
- Thermal Resistance @ Natural
- 16.1°C/W
- Material
- Aluminum
- Material Finish
- Black Anodized
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